Milestone
Achieve the unprecedented
The story, marked in light
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2026
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2026
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Aug 2025Corporate
Strategic partnership with Alchip on developing an ultra-low power photonic interconnect platform for AI-centric scale-out and scale-up applications
2025 -
2025
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2024
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Feb 2024Technology
Announced groundbreaking GeSi SPAD research published in Nature Journal
2024 -
2023
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Feb 2023Technology
Announced Artilux Nova™ Germanium-Silicon Single-Photon Avalanche Detector technology (SPAD)
2023 -
2023
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Dec 2022Corporate
Launched next-gen sensing technology, GeSi APD array equipped with Solid-State LiDAR OPA, with high gain and low noise performance for automotive applications
2022 -
Aug 2022Corporate
Branch established in Seoul, Korea
2022 -
Jul 2022Corporate
Announced partnership with Coherent to demonstrate a SWIR EEL 3D camera with GeSi array for Metaverse
2022 -
Jul 2022Technology
Announced Artilux Phoenix™ Germanium-Silicon Avalanche Photodetector Technology (APD)
2022 -
Mar 2022Corporate
Announced multi-spectral optical sensing with GeSi array and low power SWIR VCSEL for digital health with Lumentum
2022 -
Dec 2021Corporate
Branch established in Berlin, Germany
2021 -
Nov 2021Product
Announced world’s 1st SWIR CMOS biometric sensor for TWS earbuds (Aware Series: Al-CL1)
2021 -
Oct 2021Product
Announced world’s 1st long-range CMOS SWIR LiDAR system demo (Foresee Series)
2021 -
Jun 2021Product
Announced world’s 1st dual mode (2D/3D) dual band (NIR/SWIR) camera based on 12” CMOS technology (Explore Series)
2021 -
Mar 2021Technology
Announced Artilux HalcyonTM Germanium-Silicon Photodetector Technology (PD)
2021 -
Jul 2020Product
Announced world’s 1st HDMI 2.1 all optical solution for 8K TV consumer markets (Connect Series)
2020 -
Apr 2020Product
Announced 3D imager & laser driver (Explore Series: SR5/DC8)
2020 -
Mar 2020Corporate
Awarded as “2020 Biggest Breakthrough Technology” by image sensor community at Image Sensors Europe 2020
2020 -
Jan 2020Corporate
Announced collaborations with OmniVision on RGB 2D and NIR/SWIR 3D imaging solution
2020 -
Jan 2020Technology
First paper on GeSi 3D sensing system architecture with demonstration published at ISSCC (International Solid-State Circuits Conference) 2020
2020 -
Oct 2019Corporate
Engagement of Tier 1 partner in ADAS/LiDAR
2019 -
Dec 2018Technology
First paper on GeSi technology for 3D sensing published at IEDM 2018 and selected as conference media highlights
2018 -
Nov 2018Corporate
Branch established in Shenzhen, China
2018 -
Oct 2018Product
Announced world’s 1st wide spectrum NIR/SWIR 3D imager (Explore Series: SR3)
2018 -
Sep 2016Corporate
Branch established in Silicon Valley, USA
2016 -
Mar 2015Technology
Foundry engagement to implement GeSi photonics technology
2015 -
Jul 2014Corporate
Journey started in Hsinchu, Taiwan
2014