Explore
New intelligence with new dimensions
The Explore Series brings GeSi wide-spectrum 2D/3D imaging to next-generation perception — delivering compact, high-precision modules for VR/AR, robotics, industrial automation, and mobility. Engineered for sensitivity, scalability, and effortless integration, Explore turns light into spatial intelligence across 940–1550 nm, enabling depth sensing, LiDAR-ready performance, and advanced ToF perception. One platform, built to make machines and environments safer, smarter, and more aware.
Wide-spectrum 3D ToF for
real-world perception
The Challenge
Conventional 3D ToF is limited to silicon’s <1000 nm range — prone to sunlight interference, restricted eye-safety, and unreliable outdoor depth for automotive and industrial use.
The Approach
Explore pushes CMOS imaging into deep SWIR through Artilux’s GeSi platform, extending sensitivity from 940 nm to beyond 1550 nm. This wider reach delivers eye-safe illumination, stable outdoor depth, and unified 2D/3D capture — built for automotive, industrial, and next-generation intelligent machines.
Explore platform
GeSi sensitivity across a wide wavelength range lowers the retinal hazard from laser illumination.
Operating deeper into the SWIR band cuts solar background noise, holding steady indoors and out.
Optimized modulation frequency and quantum efficiency drive exceptionally high response rate and depth precision.
A single GeSi sensor array captures both 2D image and 3D depth data in one shot.
Built for
3D perception
- TOF camera lighting
- LIDAR lighting
- Pump lasers
- Laser projection
- Data transmission
- Camera lighting
| IC Package | WLCSP | Feature |
|
|---|---|---|---|
| Driving Current (Max.) | 8A | ||
| Laser Diode Channel | 4 channels | ||
| LVDS Input Freq. (Max.) | 500MHz | ||
| Interface | I²C | ||
| Outline Dimension | 2.4mm × 2.5mm |
ATLX-SR5
- 3D depth sensing
- Compact consumer & robotics imaging
| Package Type | Bare die | Feature |
|
|---|---|---|---|
| Resolution | 240 (H) × 180 (V) | ||
| Optical Format | 1/6-inch type | ||
| Shutter Type | Global Shutter | ||
| FPS | Up to 120 fps at full resolution | ||
| Pixel Size | 10 µm × 10 µm | ||
| Data Output | MIPI CSI-2 serial |
| Package Type | Bare die | Feature |
|
|---|---|---|---|
| Resolution | 640 (H) × 480 (V) | ||
| Optical Format | 1/4-inch type | ||
| Shutter Type | Global Shutter | ||
| FPS | Up to 60 fps at full resolution | ||
| Pixel Size | 5 µm × 5 µm | ||
| Data Output | MIPI CSI-2 serial |
Dual-band 3D ToF camera system with RGB-depth
- 3D depth sensing
- Compact consumer & robotics imaging
| 3D Technology | ToF, 240 × 180 pixels (HQVGA) | Dimension (W × L × H) mm | 67.5 × 26.6 × 34.8 |
|---|---|---|---|
| Lens Field of View | 57.4°(H) / 44.6°(V) / 70.1°(D) | Feature |
|
| Illumination | 940nm VCSEL | ||
| Physical Interface | USB 3.0 / Adapter power | ||
| Operating System | Windows 10 / ROS | ||
| Output Data Format | Depth Map, Amplitude Map, Point Cloud | ||
| 2D Fusion / RGB | No RGB |
| 3D Technology | ToF, 640 × 480 pixels (VGA) | Dimension (W × L × H) mm | 98.5 × 28.5 × 35.7 |
|---|---|---|---|
| Lens Field of View | 59.4°(H) / 46.3°(V) / 71.7°(D) | Feature |
|
| Illumination | 940nm VCSEL / 1380nm EEL | ||
| Physical Interface | USB 3.0 / USB PD power | ||
| Operating System | Windows 10 / ROS | ||
| Output Data Format | Depth Map, Amplitude Map, Point Cloud | ||
| 2D Fusion / RGB | With 2MP RGB |
