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Artilux Unveils World's First GeSi Wide Spectrum 3D Sensor at CES
At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world's first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infrared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 times safer than the currently-used 940nm wavelength, as well as improving sensing accuracy and performance under sunlight.
USB4-Over-Fiber IC Solution, a New Era of Lighter, Longer, and Affordable Data Transfer Medium for Consumer Markets
Artilux, the renowned leader of GeSi (Germanium Silicon) photonic technology as well as CMOS-based SWIR sensing, imaging and optical communication technology, announced today the launch of the mass-production-ready USB4 active-optical-cable IC solution. Along with Artilux’s existing IC solutions for all-optical and hybrid optical/electrical HDMI™ and DisplayPort™ applications, today’s announcement on the USB4 active-optical-cable IC solution further positions Artilux’s Connect Series product line as the most comprehensive offering in high-speed optical communications solutions for mainstream consumer markets.
Artilux Announces New GeSi 3D Sensing Technology to Improve Eye Safety and Outdoor User Experiences
Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform developed by Artilux in cooperation with TSMC.
II-VI Incorporated and Artilux Demonstrate a 3D Camera for Enhanced User Experience in the Metaverse
II‐VI Incorporated (Nasdaq: IIVI), a leader in semiconductor lasers, and Artilux, a leader in germanium silicon (GeSi) photonics and CMOS SWIR sensing technology, today announced a joint demonstration of a next-generation 3D camera with much longer range and higher image resolution to greatly enhances user experience in the metaverse.